Applications in semiconductor technology

In scarcely any other branch are technological advances progressing faster than in the semiconductor industry. Increasing performance requirements and smaller product sizes require more precise and cheaper production methods. Full surface scans of wafers and panels after backside grinding contribute significantly to reducing production costs and help to assure quality attributes.

Wafer backside grinding

Panel Level Packaging

Wir verwenden Cookies, um Ihnen die beste Online-Erfahrung zu bieten. Mit Ihrer Zustimmung akzeptieren Sie die Verwendung von Cookies in Übereinstimmung mit unseren Cookie-Richtlinien.